1. 2. 3. material content data sheet sales product name saf-xc888cm-8ffi 5v ac issued 29. august 2013 ma# MA001127792 package pg-lqfp-64-14 weight* 373.58 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 11.934 3.19 3.19 31946 31946 leadframe non noble metal magnesium 7439-95-4 0.172 0.05 459 inorganic material silicon 7440-21-3 0.743 0.20 1990 non noble metal nickel 7440-02-0 3.431 0.92 9184 non noble metal copper 7440-50-8 110.016 29.45 30.62 294490 306123 wire noble metal gold 7440-57-5 1.205 0.32 0.32 3224 3224 encapsulation organic material carbon black 1333-86-4 1.188 0.32 3180 plastics epoxy resin - 32.076 8.59 85860 inorganic material silicondioxide 60676-86-0 204.334 54.69 63.60 546961 636001 leadfinish non noble metal tin 7440-31-5 4.118 1.10 1.10 11022 11022 plating noble metal silver 7440-22-4 1.663 0.45 0.45 4452 4452 glue plastics epoxy resin - 0.675 0.18 1808 noble metal silver 7440-22-4 2.026 0.54 0.72 5424 7232 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
